Mail Archives: geda-help/2019/10/18/22:56:01
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| References: | <20191018223829 DOT 6ad6ca73fb2d77c5f389399e AT gmail DOT com>
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| In-Reply-To: | <20191019020002.088a8f4fa249e251d11adfe5@gmail.com>
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| From: | "Erich Heinzle (a1039181 AT gmail DOT com) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
|
| Date: | Sat, 19 Oct 2019 13:10:40 +1030
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| Message-ID: | <CAHUm0tM+R8PORa+US2Nt0Q1vaU80YcG9AEyH8XWUVODJAV09aA@mail.gmail.com>
|
| Subject: | Re: [geda-help] Question: New User - How To Create Very Simple Unique
|
| PCB With No Components
|
| To: | "Vladimir Zhbanov (vzhbanov AT gmail DOT com) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
|
| Reply-To: | geda-help AT delorie DOT com
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--00000000000010311305953a6102
Content-Type: text/plain; charset="UTF-8"
A few thoughts...
The characteristics of FR4 can vary depending on temperature, humidity and
frequency of operation.
The manufacturer may not be able to do the exact thickness you need.
Yes, a via would allow connection to copper on the underside to tracks on
the top layer
Regards,
Erich
On Sat, 19 Oct 2019 12:55 John L. Males (jlmales AT gmail DOT com) [via
geda-help AT delorie DOT com], <geda-help AT delorie DOT com> wrote:
> -----BEGIN PGP SIGNED MESSAGE-----
> Hash: SHA1
>
> Eric,
>
> Thanks for your reply.
>
> I hope I am replying in the correct manner for the mailing list.
>
> I left out some elements on purpose not aware of possible
> suggestion to stack the PCBs.
>
> I cannot stack two PCBs for thickness reasons that are actually
> specific for the this simple PCB board. The thickness of the
> board will need to be about 0.79mm. As indicated PCB thickness
> is specified when board is made and not in the PCB software.
>
> I thought is would be simple to have a copper plane on both
> sides of board and to include holes in this simple PCB. The
> simple PCB board is a capacitor based on copper surface area
> minus the holes that need to be there to allow air to
> freely move due to the plates on either side of the simple PCB
> I want to make. The PCB I want to make needs a 0.79mm gap
> between the two copper planes of the PCB, ergo a PCB
> thickness of about 0.79mm.
>
> The copper area will be about the middle 80% (off top of my
> head). I have not calculated the exact surface area of the two
> copper planes yet. The minimum board span will be 4 inches
> minus about 1.25 inches for the combined sides the board is
> mounted on and the gap of the moving plates this PCB will be
> sandwiched between.
>
> I indicated minimum board span as I may want to add about 0.75
> inches to one side of the PCB length to overhang on one side of
> the span points. This to allow easy access and clearance for
> connectors if I choose to design for connectors. A soldered to
> board wires via solder pads that will not need any board
> overhang.
>
> In essence I need two layers, but thought it might be useful
> for third layer that runs inside the board that brings traces
> out from each copper plane. The intent was to make it easy for
> the lead out traces not to short on the aluminum block at the
> end where the connections are made to the PCB via wires or
> connectors.
>
> Maybe I have to consider adding thin coat of varathane to
> insulate the lower trace to a top trace transition for
> connection of wires via pad or connectors. The top side of the
> board is not in contact with any metal. Might that present a
> way to transition the lower plane of copper to an upper trace?
> Is a via the correct term/approach to allow? I can ensure the
> is a bit of gap and enough clearance from the aluminum
> mounting block for a via or what it needed to transition a
> bottom trace/copper to upper trace for solder pad or connector.
>
> If it is useful I could see if I can create an image of both
> sides of board with a drawing program. I am not certain if I
> can, but I can see if that helps clarify my attempt to
> articulate what I am trying to do.
>
>
> John L. Males
> Toronto, Ontario
> Canada
> 18 October 2019 22:00 -0400 EDT
>
>
> ================================================================
>
> 2019-10-19 01:25:11+0000-UTC Time: 1571448311 PC/System time
>
> 19 Oct 01:25:11 ntpdate[15820]: ntpdate 4.2.8p12-a (1)
>
> 19 Oct 01:25:26 ntpdate[17068]: step time server 206.108.0.132
> offset 0.001708 sec
>
> FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul 11
> 16:13:47 UTC 2019
> root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC
>
> (Work in progress alternative to Linux Kernel of its own right,
> Debian, and
> other Linux based Kernel distributions determined.)
>
> Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
> Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class
> CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz
> K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
> (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @
> 1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M
> CPU @ 1.40GHz (1396.86-MHz K8-class CPU)
>
> dev.cpu.0.temperature: 69.0C
> dev.cpu.1.temperature: 68.0C
> dev.cpu.2.temperature: 64.0C
> dev.cpu.3.temperature: 64.0C
> hw.acpi.thermal.tz0.temperature: 69.1C
>
> vmstat -s:
>
> 188317092 cpu context switches
> 7044759 device interrupts
> 1014980 software interrupts
> 51267914 traps
> 479658084 system calls
> 27 kernel threads created
> 3253 fork() calls
> 1051 vfork() calls
> 0 rfork() calls
> 0 swap pager pageins
> 0 swap pager pages paged in
> 0 swap pager pageouts
> 0 swap pager pages paged out
> 8798 vnode pager pageins
> 122396 vnode pager pages paged in
> 322 vnode pager pageouts
> 3527 vnode pager pages paged out
> 11 page daemon wakeups
> 29799537 pages examined by the page daemon
> 0 clean page reclamation shortfalls
> 369964 pages reactivated by the page daemon
> 528547 copy-on-write faults
> 9933 copy-on-write optimized faults
> 33166324 zero fill pages zeroed
> 25991 zero fill pages prezeroed
> 1622 intransit blocking page faults
> 52124252 total VM faults taken
> 12676 page faults requiring I/O
> 0 pages affected by kernel thread creation
> 373301 pages affected by fork()
> 36978 pages affected by vfork()
> 0 pages affected by rfork()
> 37526757 pages freed
> 308705 pages freed by daemon
> 17242344 pages freed by exiting processes
> 473888 pages active
> 1014069 pages inactive
> 208348 pages in the laundry queue
> 250554 pages wired down
> 60872 pages free
> 4096 bytes per page
> 3737378 total name lookups
> cache hits (93% pos + 4% neg) system 0% per-directory
> deletions 0%, falsehits 0%, toolong 0%
>
> Boot time : 1571414099
>
> procs memory page disks
> faults cpu0 cpu1 cpu2 cpu3 r b w avm
> fre flt re pi po fr sr ad0 pa0 in sy cs us sy
> id us sy id us sy id us sy id 0 0 0 32149200 243428 1523 11
> 0 0 1096 871 0 0 206 14014 5502 11 7 82 12 4 84 12
> 3 84 12 3 84
>
> memory info:
>
> real memory = 8589934592 (8192 MB)
> avail memory = 8166465536 (7788 MB)
>
> last pid: 23225; load averages: 1.41, 0.92, 0.69 up
> 0+09:30:27 01:25:26 60 processes: 1 running, 59 sleeping
>
> Mem: 1852M Active, 3961M Inact, 814M Laundry, 979M Wired, 510M
> Buf, 237M Free Swap: 48G Total, 48G Free
>
> hw.physmem: 8463925248
> hw.usermem: 7437496320
> hw.realmem: 8589934592
>
> total used free shared
> buffers cached Mem: 8030732 3731096
> 4299636 0 0 0 Swap:
> 50331644 0 50331644
>
> swapinfo:
>
> Device 1K-blocks Used Avail Capacity
> /dev/ada0s1b 50331644 0 50331644 0%
>
> vmstat:
>
> procs memory page disks
> faults cpu r b w avm fre flt re pi po
> fr sr ad0 pa0 in sy cs us sy id 0 0 0 32149200
> 243400 1523 11 0 0 1096 871 0 0 206 14014 5502 12
> 4 84
>
>
> Message replied to:
>
> Date: Sat, 19 Oct 2019 11:12:00 +1030
> From: "Erich Heinzle (a1039181 AT gmail DOT com) [via
> geda-help AT delorie DOT com]" <geda-help AT delorie DOT com> To: "Vladimir
> Zhbanov (vzhbanov AT gmail DOT com) [via geda-help AT delorie DOT com]"
> <geda-help AT delorie DOT com> Subject: Re: [geda-help] Question: New
> User - How To Create Very Simple Unique PCB With No Components
>
>
> > The PCB thickness is usually selected at the time of ordering
> > the board from the manufacturer.
> >
> > Routine FR4 is 1.6mm thick, with 1 or 2 oz per square foot of
> > copper for the front and back planes.
> >
> > The next option up from double sided is 4 layer boards, which
> > are quite a bit more expensive.
> >
> > My approach to your board stack up would be to make two
> > double sided boards which have fairly full copper coverage on
> > their bottom layers and then get stacked one on top of the
> > other, with the full copper planes outermost. You can then
> > make any holes in the two boards correspond for all the way
> > through perforations, or not, for part way perforations into
> > the middle layer(s) section for access to any trackwork.
> >
> > Attention to registration marks, (maybe using some drill
> > holes for mountung hardware for this) would be important.
> >
> > Apertures on a board are defined with the outline layer, and
> > need to take account of a milling cutter's typically 0.8mm
> > diameter, and the centres of the lines on the outline layer
> > for apertures define the path of the cutter's outer radius.
> >
> > If you need slots, or windowing of solder mask layers, it may
> > be easier to do the board in pcb-rnd, which supports slots,
> > as well as arbitrary negative apertures on the solder mask
> > layer, which may be necessary, depending on your plans for
> > exposure of the inner and outer layer copper areas.
> >
> > You could do most of the above as a four layer board, by
> > censoring/eliminating one of the internal layers, but you may
> > be paying a lot to do this, and may struggle to get the
> > openings you want communicated effectively to the board
> > fabricator.
> >
> > Regards,
> >
> > Erich
> >
> > On Sat, 19 Oct 2019 09:34 John L. Males (jlmales AT gmail DOT com)
> > [via geda-help AT delorie DOT com], <geda-help AT delorie DOT com> wrote:
> >
> > > -----BEGIN PGP SIGNED MESSAGE-----
> > > Hash: SHA1
> > >
> > > Hello,
> > >
> > > This is my first posting here. I do not know if the mailing
> > > list will automatically eMail me a reply. I have looked at
> > > the mailing list commands and options I cannot find if and
> > > how I may set if replies to me or others can be set.
> > >
> > > I am new to PCB software, but have reasonable average
> > > electronics skills over a number of years.
> > >
> > > I have a simple and unique challenge I have tried many
> > > different ways to figure out. I have done alot of internet
> > > searching, looked at many tutorials, and tried using PCB
> > > based on tutorials and my own exploring about PCB to find
> > > how I do this simple and unique PCB.
> > >
> > > I need to create a PCB that has a copper plane on top and
> > > bottom of the PCB. That simple. No components. It is
> > > likely via a third layer between the top and bottom copper
> > > planes I will want traces out to holes I may make as solder
> > > tabs or us a connector of some type. The reason for the
> > > trace connections as a third layer is to ensure the traces
> > > do not short with the aluminum parts metal part the PCB has
> > > to be mounted to directly at each end of the PCB.
> > >
> > > Then I will need to create a set of holes in the parallel
> > > copper planes area whose sole purpose is to let air pass
> > > between and not be a connection between the top and bottom
> > > copper planes.
> > >
> > > If I need to specify a PCB thickness then how I do so. So
> > > far I have not been able to find a setting/preference for
> > > the PCB thickness to do so.
> > >
> > > The how to do the connector and/or solder tab is not
> > > critical to the primary question. I will try to figure
> > > that out after I have the most important part of the PCB as
> > > noted above done in PCB.
> > >
> > > I will need to do a second PCB, but it will have lots of
> > > components on it. I would need to enter the schematic
> > > first of curse. I suspect I will manage with the help
> > > examples I have already read and will read again when I am
> > > ready to create a PCB from the schematic.
> > >
> > > If there is any missing part of the information to my core
> > > question of copper planes on top/bottom and holes in the
> > > copper plane that do not connect the top and bottom copper
> > > planes feel free to ask or comment on.
> > >
> > >
> > > John L. Males
> > > Toronto, Ontario
> > > Canada
> > > 18 October 2019 18:38 -0400 EDT
> > >
> > >
> > > ================================================================
> > >
> > > 2019-10-18 22:05:20+0000-UTC Time: 1571436320 PC/System time
> > >
> > > 18 Oct 22:05:20 ntpdate[85789]: ntpdate 4.2.8p12-a (1)
> > >
> > > 18 Oct 22:05:35 ntpdate[87775]: step time server
> > > 206.108.0.131 offset -0.004716 sec
> > >
> > > FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul
> > > 11 16:13:47 UTC 2019
> > > root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC
> > >
> > > (Work in progress alternative to Linux Kernel of its own
> > > right, Debian, and
> > > other Linux based Kernel distributions determined.)
> > >
> > > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
> > > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz
> > > K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
> > > (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @
> > > 1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM)
> > > i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU) Intel(R)
> > > Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU)
> > >
> > > dev.cpu.0.temperature: 71.0C
> > > dev.cpu.1.temperature: 70.0C
> > > dev.cpu.2.temperature: 66.0C
> > > dev.cpu.3.temperature: 66.0C
> > > hw.acpi.thermal.tz0.temperature: 72.1C
> > >
> > > vmstat -s:
> > >
> > > 128476253 cpu context switches
> > > 4928508 device interrupts
> > > 661878 software interrupts
> > > 41825629 traps
> > > 346413636 system calls
> > > 27 kernel threads created
> > > 3000 fork() calls
> > > 793 vfork() calls
> > > 0 rfork() calls
> > > 0 swap pager pageins
> > > 0 swap pager pages paged in
> > > 0 swap pager pageouts
> > > 0 swap pager pages paged out
> > > 8688 vnode pager pageins
> > > 120478 vnode pager pages paged in
> > > 322 vnode pager pageouts
> > > 3527 vnode pager pages paged out
> > > 3 page daemon wakeups
> > > 19153450 pages examined by the page daemon
> > > 0 clean page reclamation shortfalls
> > > 198910 pages reactivated by the page daemon
> > > 502073 copy-on-write faults
> > > 9226 copy-on-write optimized faults
> > > 27520777 zero fill pages zeroed
> > > 24413 zero fill pages prezeroed
> > > 1622 intransit blocking page faults
> > > 42301697 total VM faults taken
> > > 12576 page faults requiring I/O
> > > 0 pages affected by kernel thread creation
> > > 357307 pages affected by fork()
> > > 28026 pages affected by vfork()
> > > 0 pages affected by rfork()
> > > 30941382 pages freed
> > > 89018 pages freed by daemon
> > > 13777017 pages freed by exiting processes
> > > 470801 pages active
> > > 1014759 pages inactive
> > > 191320 pages in the laundry queue
> > > 234660 pages wired down
> > > 96191 pages free
> > > 4096 bytes per page
> > > 3108988 total name lookups
> > > cache hits (93% pos + 4% neg) system 0%
> > > per-directory deletions 0%, falsehits 0%, toolong 0%
> > >
> > > Boot time : 1571414099
> > >
> > > procs memory page disks
> > > faults cpu0 cpu1 cpu2 cpu3 r b w avm
> > > fre flt re pi po fr sr ad0 pa0 in sy cs us
> > > sy id us sy id us sy id us sy id 0 0 0 31449076 384704
> > > 1902 9 0 0 1391 861 0 0 222 15578 5778 12 8 80
> > > 14 4 82 14 4 82 14 4 82
> > >
> > > memory info:
> > >
> > > real memory = 8589934592 (8192 MB)
> > > avail memory = 8166465536 (7788 MB)
> > >
> > > last pid: 92816; load averages: 0.46, 0.66, 0.83 up
> > > 0+06:10:37 22:05:36 56 processes: 1 running, 55 sleeping
> > >
> > > Mem: 1840M Active, 3964M Inact, 747M Laundry, 917M Wired,
> > > 474M Buf, 375M Free Swap: 48G Total, 48G Free
> > >
> > > hw.physmem: 8463925248
> > > hw.usermem: 7502598144
> > > hw.realmem: 8589934592
> > >
> > > total used free shared
> > > buffers cached Mem: 8030732 3587088
> > > 4443644 0 0 0 Swap:
> > > 50331644 0 50331644
> > >
> > > swapinfo:
> > >
> > > Device 1K-blocks Used Avail Capacity
> > > /dev/ada0s1b 50331644 0 50331644 0%
> > >
> > > vmstat:
> > >
> > > procs memory page disks
> > > faults cpu r b w avm fre flt re pi po
> > > fr sr ad0 pa0 in sy cs us sy id 1 0 0 31449076
> > > 384420 1902 9 0 0 1392 861 0 0 222 15579 5778
> > > 14 5 82
> > >
> > > -----BEGIN PGP SIGNATURE-----
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> > > EOyNAJ4pUcQHIpLxnd+pLuGS8fKL02HRbACgmfoIR22ub7kGannIpdUvjGVs2pI=
> > > =sFDL
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> > >
> -----BEGIN PGP SIGNATURE-----
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--00000000000010311305953a6102
Content-Type: text/html; charset="UTF-8"
Content-Transfer-Encoding: quoted-printable
<div dir=3D"auto">A few thoughts...<div dir=3D"auto"><br></div><div dir=3D"=
auto">The characteristics of FR4 can vary depending on temperature, humidit=
y and frequency of operation.<div dir=3D"auto"><br></div><div dir=3D"auto">=
The manufacturer may not be able to do the exact thickness you need.</div><=
div dir=3D"auto"><br></div><div dir=3D"auto">Yes, a via would allow connect=
ion to copper on the underside to tracks on the top layer</div><div dir=3D"=
auto"><br></div><div dir=3D"auto">Regards,</div><div dir=3D"auto"><br></div=
><div dir=3D"auto">Erich</div></div></div><br><div class=3D"gmail_quote"><d=
iv dir=3D"ltr" class=3D"gmail_attr">On Sat, 19 Oct 2019 12:55 John L. Males=
(<a href=3D"mailto:jlmales AT gmail DOT com">jlmales AT gmail DOT com</a>) [via <a href=
=3D"mailto:geda-help AT delorie DOT com">geda-help AT delorie DOT com</a>], <<a href=
=3D"mailto:geda-help AT delorie DOT com">geda-help AT delorie DOT com</a>> wrote:<br><=
/div><blockquote class=3D"gmail_quote" style=3D"margin:0 0 0 .8ex;border-le=
ft:1px #ccc solid;padding-left:1ex">-----BEGIN PGP SIGNED MESSAGE-----<br>
Hash: SHA1<br>
<br>
Eric,<br>
<br>
Thanks for your reply.<br>
<br>
I hope I am replying in the correct manner for the mailing list.<br>
<br>
I left out some elements on purpose not aware of possible<br>
suggestion to stack the PCBs.<br>
<br>
I cannot stack two PCBs for thickness reasons that are actually<br>
specific for the this simple PCB board.=C2=A0 The thickness of the<br>
board will need to be about 0.79mm.=C2=A0 As indicated PCB thickness<br>
is specified when board is made and not in the PCB software.<br>
<br>
I thought is would be simple to have a copper plane on both<br>
sides of board and to include holes in this simple PCB.=C2=A0 The<br>
simple PCB board is a capacitor based on copper surface area<br>
minus the holes that need to be there to allow air to<br>
freely move due to the plates on either side of the simple PCB<br>
I want to make.=C2=A0 The PCB I want to make needs a 0.79mm gap<br>
between the two copper planes of the PCB, ergo a PCB<br>
thickness of about 0.79mm.<br>
<br>
The copper area will be about the middle 80% (off top of my<br>
head). I have not calculated the exact surface area of the two<br>
copper planes yet.=C2=A0 The minimum board span will be 4 inches<br>
minus about 1.25 inches for the combined sides the board is<br>
mounted on and the gap of the moving plates this PCB will be<br>
sandwiched between.<br>
<br>
I indicated minimum board span as I may want to add about 0.75<br>
inches to one side of the PCB length to overhang on one side of<br>
the span points.=C2=A0 This to allow easy access and clearance for<br>
connectors if I choose to design for connectors.=C2=A0 A soldered to<br>
board wires via solder pads that will not need any board<br>
overhang.<br>
<br>
In essence I need two layers, but thought it might be useful<br>
for third layer that runs inside the board that brings traces<br>
out from each copper plane.=C2=A0 The intent was to make it easy for<br>
the lead out traces not to short on the aluminum block at the<br>
end where the connections are made to the PCB via wires or<br>
connectors.<br>
<br>
Maybe I have to consider adding thin coat of varathane to<br>
insulate the lower trace to a top trace transition for<br>
connection of wires via pad or connectors.=C2=A0 The top side of the<br>
board is not in contact with any metal.=C2=A0 Might that present a<br>
way to transition the lower plane of copper to an upper trace?<br>
Is a via the correct term/approach to allow?=C2=A0 I can ensure the<br>
is a bit of gap and enough clearance from the aluminum<br>
mounting block for a via or what it needed to transition a<br>
bottom trace/copper to upper trace for solder pad or connector.<br>
<br>
If it is useful I could see if I can create an image of both<br>
sides of board with a drawing program.=C2=A0 I am not certain if I<br>
can, but I can see if that helps clarify my attempt to<br>
articulate what I am trying to do.<br>
<br>
<br>
John L. Males<br>
Toronto, Ontario<br>
Canada<br>
18 October 2019 22:00 -0400 EDT<br>
<br>
<br>
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D<br>
<br>
2019-10-19 01:25:11+0000-UTC Time: 1571448311 PC/System time<br>
<br>
19 Oct 01:25:11 ntpdate[15820]: ntpdate 4.2.8p12-a (1)<br>
<br>
19 Oct 01:25:26 ntpdate[17068]: step time server 206.108.0.132<br>
offset 0.001708 sec<br>
<br>
FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul 11<br>
16:13:47 UTC 2019<br>
root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC <br>
<br>
(Work in progress alternative to Linux Kernel of its own right,<br>
=C2=A0Debian, and<br>
=C2=A0other Linux based Kernel distributions determined.)<br>
<br>
Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class<br>
CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz<br>
K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
(1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @<br>
1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M<br>
CPU @ 1.40GHz (1396.86-MHz K8-class CPU)<br>
<br>
dev.cpu.0.temperature: 69.0C<br>
dev.cpu.1.temperature: 68.0C<br>
dev.cpu.2.temperature: 64.0C<br>
dev.cpu.3.temperature: 64.0C<br>
hw.acpi.thermal.tz0.temperature: 69.1C<br>
<br>
vmstat -s:<br>
<br>
188317092 cpu context switches<br>
=C2=A0 7044759 device interrupts<br>
=C2=A0 1014980 software interrupts<br>
=C2=A051267914 traps<br>
479658084 system calls<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A027 kernel threads created<br>
=C2=A0 =C2=A0 =C2=A03253=C2=A0 fork() calls<br>
=C2=A0 =C2=A0 =C2=A01051 vfork() calls<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 rfork() calls<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pageins<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pages paged in<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pageouts<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pages paged out<br>
=C2=A0 =C2=A0 =C2=A08798 vnode pager pageins<br>
=C2=A0 =C2=A0122396 vnode pager pages paged in<br>
=C2=A0 =C2=A0 =C2=A0 322 vnode pager pageouts<br>
=C2=A0 =C2=A0 =C2=A03527 vnode pager pages paged out<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A011 page daemon wakeups<br>
=C2=A029799537 pages examined by the page daemon<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 clean page reclamation shortfalls<br>
=C2=A0 =C2=A0369964 pages reactivated by the page daemon<br>
=C2=A0 =C2=A0528547 copy-on-write faults<br>
=C2=A0 =C2=A0 =C2=A09933 copy-on-write optimized faults<br>
=C2=A033166324 zero fill pages zeroed<br>
=C2=A0 =C2=A0 25991 zero fill pages prezeroed<br>
=C2=A0 =C2=A0 =C2=A01622 intransit blocking page faults<br>
=C2=A052124252 total VM faults taken<br>
=C2=A0 =C2=A0 12676 page faults requiring I/O<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 pages affected by kernel thread creation<br>
=C2=A0 =C2=A0373301 pages affected by=C2=A0 fork()<br>
=C2=A0 =C2=A0 36978 pages affected by vfork()<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 pages affected by rfork()<br>
=C2=A037526757 pages freed<br>
=C2=A0 =C2=A0308705 pages freed by daemon<br>
=C2=A017242344 pages freed by exiting processes<br>
=C2=A0 =C2=A0473888 pages active<br>
=C2=A0 1014069 pages inactive<br>
=C2=A0 =C2=A0208348 pages in the laundry queue<br>
=C2=A0 =C2=A0250554 pages wired down<br>
=C2=A0 =C2=A0 60872 pages free<br>
=C2=A0 =C2=A0 =C2=A04096 bytes per page<br>
=C2=A0 3737378 total name lookups<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 cache hits (93% pos + 4% neg) system 0% =
per-directory<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 deletions 0%, falsehits 0%, toolong 0%<b=
r>
<br>
Boot time : 1571414099<br>
<br>
procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=C2=A0 =C2=
=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks<br>
faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 cpu0=C2=A0 =C2=A0 =C2=A0cpu1=C2=A0 =C2=A0=
=C2=A0cpu2=C2=A0 =C2=A0 =C2=A0cpu3 r b w=C2=A0 =C2=A0 =C2=A0avm<br>
fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po=C2=A0 =C2=A0 fr=C2=A0 =C2=A0sr ad0=
pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =C2=A0 cs us sy<br>
id us sy id us sy id us sy id 0 0 0 32149200=C2=A0 243428 1523=C2=A0 11<br>
0=C2=A0 =C2=A00=C2=A0 1096=C2=A0 871=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 206 =
14014=C2=A0 5502 11=C2=A0 7 82 12=C2=A0 4 84 12<br>
3 84 12=C2=A0 3 84<br>
<br>
memory info:<br>
<br>
real memory=C2=A0 =3D 8589934592 (8192 MB)<br>
avail memory =3D 8166465536 (7788 MB)<br>
<br>
last pid: 23225;=C2=A0 load averages:=C2=A0 1.41,=C2=A0 0.92,=C2=A0 0.69=C2=
=A0 up<br>
0+09:30:27=C2=A0 =C2=A0 01:25:26 60 processes:=C2=A0 1 running, 59 sleeping=
<br>
<br>
Mem: 1852M Active, 3961M Inact, 814M Laundry, 979M Wired, 510M<br>
Buf, 237M Free Swap: 48G Total, 48G Free<br>
<br>
hw.physmem: 8463925248<br>
hw.usermem: 7437496320<br>
hw.realmem: 8589934592<br>
<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0total=C2=A0 =C2=A0 =C2=A0 =
=C2=A0used=C2=A0 =C2=A0 =C2=A0 =C2=A0free=C2=A0 =C2=A0 =C2=A0shared<br>
buffers=C2=A0 =C2=A0 =C2=A0cached Mem:=C2=A0 =C2=A0 =C2=A0 =C2=A08030732=C2=
=A0 =C2=A0 3731096<br>
4299636=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=
=A0 0=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0 Swap:<br>
50331644=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A050331644<br>
<br>
swapinfo:<br>
<br>
Device=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 1K-blocks=C2=A0 =C2=A0 =C2=A0Used=
=C2=A0 =C2=A0 Avail Capacity<br>
/dev/ada0s1b=C2=A0 =C2=A0 =C2=A050331644=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 50331=
644=C2=A0 =C2=A0 =C2=A00%<br>
<br>
vmstat:<br>
<br>
procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=C2=A0 =C2=
=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks<br>
faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0cpu r b w=C2=A0 =C2=A0 =C2=A0avm=C2=
=A0 =C2=A0 =C2=A0fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po<br>
fr=C2=A0 =C2=A0sr ad0 pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =C2=A0 cs us=
sy id 0 0 0 32149200<br>
243400 1523=C2=A0 11=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 1096=C2=A0 871=C2=A0=
=C2=A00=C2=A0 =C2=A00=C2=A0 206 14014=C2=A0 5502 12<br>
4 84<br>
<br>
<br>
Message replied to:<br>
<br>
Date: Sat, 19 Oct 2019 11:12:00 +1030<br>
From: "Erich Heinzle (<a href=3D"mailto:a1039181 AT gmail DOT com" target=3D"=
_blank" rel=3D"noreferrer">a1039181 AT gmail DOT com</a>) [via<br>
<a href=3D"mailto:geda-help AT delorie DOT com" target=3D"_blank" rel=3D"noreferre=
r">geda-help AT delorie DOT com</a>]" <<a href=3D"mailto:geda-help AT delorie=
.com" target=3D"_blank" rel=3D"noreferrer">geda-help AT delorie DOT com</a>> To=
: "Vladimir<br>
Zhbanov (<a href=3D"mailto:vzhbanov AT gmail DOT com" target=3D"_blank" rel=3D"nor=
eferrer">vzhbanov AT gmail DOT com</a>) [via <a href=3D"mailto:geda-help AT delorie DOT c=
om" target=3D"_blank" rel=3D"noreferrer">geda-help AT delorie DOT com</a>]"<b=
r>
<<a href=3D"mailto:geda-help AT delorie DOT com" target=3D"_blank" rel=3D"noref=
errer">geda-help AT delorie DOT com</a>> Subject: Re: [geda-help] Question: New=
<br>
User - How To Create Very Simple Unique PCB With No Components<br>
<br>
<br>
> The PCB thickness is usually selected at the time of ordering<br>
> the board from the manufacturer.<br>
> <br>
> Routine FR4 is 1.6mm thick, with 1 or 2 oz per square foot of<br>
> copper for the front and back planes.<br>
> <br>
> The next option up from double sided is 4 layer boards, which<br>
> are quite a bit more expensive.<br>
> <br>
> My approach to your board stack up would be to make two<br>
> double sided boards which have fairly full copper coverage on<br>
> their bottom layers and then get stacked one on top of the<br>
> other, with the full copper planes outermost. You can then<br>
> make any holes in the two boards correspond for all the way<br>
> through perforations, or not, for part way perforations into<br>
> the middle layer(s) section for access to any trackwork.<br>
> <br>
> Attention to registration marks, (maybe=C2=A0 using some drill<br>
> holes for mountung hardware for this) would be important.<br>
> <br>
> Apertures on a board are defined with the outline layer, and<br>
> need to take account of a milling cutter's typically 0.8mm<br>
> diameter, and the centres of the lines on the outline layer<br>
> for apertures define the path of the cutter's outer radius.<br>
> <br>
> If you need slots, or windowing of solder mask layers, it may<br>
> be easier to do the board in pcb-rnd, which supports slots,<br>
> as well as arbitrary negative apertures on the solder mask<br>
> layer, which may be necessary, depending on your plans for<br>
> exposure of the inner and outer layer copper areas.<br>
> <br>
> You could do most of the above as a four layer board, by<br>
> censoring/eliminating one of the internal layers, but you may<br>
> be paying a lot to do this, and may struggle to get the<br>
> openings you want communicated effectively to the board<br>
> fabricator.<br>
> <br>
> Regards,<br>
> <br>
> Erich<br>
> <br>
> On Sat, 19 Oct 2019 09:34 John L. Males (<a href=3D"mailto:jlmales AT gma=
il.com" target=3D"_blank" rel=3D"noreferrer">jlmales AT gmail DOT com</a>)<br>
> [via <a href=3D"mailto:geda-help AT delorie DOT com" target=3D"_blank" rel=3D=
"noreferrer">geda-help AT delorie DOT com</a>], <<a href=3D"mailto:geda-help AT de=
lorie.com" target=3D"_blank" rel=3D"noreferrer">geda-help AT delorie DOT com</a>&g=
t; wrote:<br>
> <br>
> > -----BEGIN PGP SIGNED MESSAGE-----<br>
> > Hash: SHA1<br>
> ><br>
> > Hello,<br>
> ><br>
> > This is my first posting here.=C2=A0 I do not know if the mailing=
<br>
> > list will automatically eMail me a reply.=C2=A0 I have looked at<=
br>
> > the mailing list commands and options I cannot find if and<br>
> > how I may set if replies to me or others can be set.<br>
> ><br>
> > I am new to PCB software, but have reasonable average<br>
> > electronics skills over a number of years.<br>
> ><br>
> > I have a simple and unique challenge I have tried many<br>
> > different ways to figure out.=C2=A0 I have done alot of internet<=
br>
> > searching, looked at many tutorials, and tried using PCB<br>
> > based on tutorials and my own exploring about PCB to find<br>
> > how I do this simple and unique PCB.<br>
> ><br>
> > I need to create a PCB that has a copper plane on top and<br>
> > bottom of the PCB.=C2=A0 That simple.=C2=A0 No components.=C2=A0 =
It is<br>
> > likely via a third layer between the top and bottom copper<br>
> > planes I will want traces out to holes I may make as solder<br>
> > tabs or us a connector of some type.=C2=A0 The reason for the<br>
> > trace connections as a third layer is to ensure the traces<br>
> > do not short with the aluminum parts metal part the PCB has<br>
> > to be mounted to directly at each end of the PCB.<br>
> ><br>
> > Then I will need to create a set of holes in the parallel<br>
> > copper planes area whose sole purpose is to let air pass<br>
> > between and not be a connection between the top and bottom<br>
> > copper planes.<br>
> ><br>
> > If I need to specify a PCB thickness then how I do so.=C2=A0 So<b=
r>
> > far I have not been able to find a setting/preference for<br>
> > the PCB thickness to do so.<br>
> ><br>
> > The how to do the connector and/or solder tab is not<br>
> > critical to the primary question.=C2=A0 I will try to figure<br>
> > that out after I have the most important part of the PCB as<br>
> > noted above done in PCB.<br>
> ><br>
> > I will need to do a second PCB, but it will have lots of<br>
> > components on it.=C2=A0 I would need to enter the schematic<br>
> > first of curse. I suspect I will manage with the help<br>
> > examples I have already read and will read again when I am<br>
> > ready to create a PCB from the schematic.<br>
> ><br>
> > If there is any missing part of the information to my core<br>
> > question of copper planes on top/bottom and holes in the<br>
> > copper plane that do not connect the top and bottom copper<br>
> > planes feel free to ask or comment on.<br>
> ><br>
> ><br>
> > John L. Males<br>
> > Toronto, Ontario<br>
> > Canada<br>
> > 18 October 2019 18:38 -0400 EDT<br>
> ><br>
> ><br>
> > =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D<br>
> ><br>
> > 2019-10-18 22:05:20+0000-UTC Time: 1571436320 PC/System time<br>
> ><br>
> > 18 Oct 22:05:20 ntpdate[85789]: ntpdate 4.2.8p12-a (1)<br>
> ><br>
> > 18 Oct 22:05:35 ntpdate[87775]: step time server<br>
> > 206.108.0.131 offset -0.004716 sec<br>
> ><br>
> > FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul<br>
> > 11 16:13:47 UTC 2019<br>
> > root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC<br>
> ><br>
> > (Work in progress alternative to Linux Kernel of its own<br>
> > right, Debian, and<br>
> >=C2=A0 other Linux based Kernel distributions determined.)<br>
> ><br>
> > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
> > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz<br>
> > K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
> > (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @<br>
> > 1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM)<br>
> > i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU) Intel(R)<br>
> > Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU)<br>
> ><br>
> > dev.cpu.0.temperature: 71.0C<br>
> > dev.cpu.1.temperature: 70.0C<br>
> > dev.cpu.2.temperature: 66.0C<br>
> > dev.cpu.3.temperature: 66.0C<br>
> > hw.acpi.thermal.tz0.temperature: 72.1C<br>
> ><br>
> > vmstat -s:<br>
> ><br>
> > 128476253 cpu context switches<br>
> >=C2=A0 =C2=A04928508 device interrupts<br>
> >=C2=A0 =C2=A0 661878 software interrupts<br>
> >=C2=A0 41825629 traps<br>
> > 346413636 system calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 27 kernel threads created<br>
> >=C2=A0 =C2=A0 =C2=A0 3000=C2=A0 fork() calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0793 vfork() calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 rfork() calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pageins<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pages paged in<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pageouts<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pages paged out<br>
> >=C2=A0 =C2=A0 =C2=A0 8688 vnode pager pageins<br>
> >=C2=A0 =C2=A0 120478 vnode pager pages paged in<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0322 vnode pager pageouts<br>
> >=C2=A0 =C2=A0 =C2=A0 3527 vnode pager pages paged out<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A03 page daemon wakeups<br>
> >=C2=A0 19153450 pages examined by the page daemon<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 clean page reclamation shortfa=
lls<br>
> >=C2=A0 =C2=A0 198910 pages reactivated by the page daemon<br>
> >=C2=A0 =C2=A0 502073 copy-on-write faults<br>
> >=C2=A0 =C2=A0 =C2=A0 9226 copy-on-write optimized faults<br>
> >=C2=A0 27520777 zero fill pages zeroed<br>
> >=C2=A0 =C2=A0 =C2=A024413 zero fill pages prezeroed<br>
> >=C2=A0 =C2=A0 =C2=A0 1622 intransit blocking page faults<br>
> >=C2=A0 42301697 total VM faults taken<br>
> >=C2=A0 =C2=A0 =C2=A012576 page faults requiring I/O<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 pages affected by kernel threa=
d creation<br>
> >=C2=A0 =C2=A0 357307 pages affected by=C2=A0 fork()<br>
> >=C2=A0 =C2=A0 =C2=A028026 pages affected by vfork()<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 pages affected by rfork()<br>
> >=C2=A0 30941382 pages freed<br>
> >=C2=A0 =C2=A0 =C2=A089018 pages freed by daemon<br>
> >=C2=A0 13777017 pages freed by exiting processes<br>
> >=C2=A0 =C2=A0 470801 pages active<br>
> >=C2=A0 =C2=A01014759 pages inactive<br>
> >=C2=A0 =C2=A0 191320 pages in the laundry queue<br>
> >=C2=A0 =C2=A0 234660 pages wired down<br>
> >=C2=A0 =C2=A0 =C2=A096191 pages free<br>
> >=C2=A0 =C2=A0 =C2=A0 4096 bytes per page<br>
> >=C2=A0 =C2=A03108988 total name lookups<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0cache hits (93% pos + 4% =
neg) system 0%<br>
> > per-directory deletions 0%, falsehits 0%, toolong 0%<br>
> ><br>
> > Boot time : 1571414099<br>
> ><br>
> > procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks=
<br>
> > faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 cpu0=C2=A0 =C2=A0 =C2=A0cpu1=C2=
=A0 =C2=A0 =C2=A0cpu2=C2=A0 =C2=A0 =C2=A0cpu3 r b w=C2=A0 =C2=A0 =C2=A0avm<=
br>
> > fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po=C2=A0 =C2=A0 fr=C2=A0 =
=C2=A0sr ad0 pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =C2=A0 cs us<br>
> > sy id us sy id us sy id us sy id 0 0 0 31449076=C2=A0 384704<br>
> > 1902=C2=A0 =C2=A09 0=C2=A0 =C2=A00=C2=A0 1391=C2=A0 861=C2=A0 =C2=
=A00=C2=A0 =C2=A00=C2=A0 222 15578=C2=A0 5778 12=C2=A0 8 80<br>
> > 14=C2=A0 4 82 14 4 82 14=C2=A0 4 82<br>
> ><br>
> > memory info:<br>
> ><br>
> > real memory=C2=A0 =3D 8589934592 (8192 MB)<br>
> > avail memory =3D 8166465536 (7788 MB)<br>
> ><br>
> > last pid: 92816;=C2=A0 load averages:=C2=A0 0.46,=C2=A0 0.66,=C2=
=A0 0.83=C2=A0 up<br>
> > 0+06:10:37=C2=A0 =C2=A0 22:05:36 56 processes:=C2=A0 1 running, 5=
5 sleeping<br>
> ><br>
> > Mem: 1840M Active, 3964M Inact, 747M Laundry, 917M Wired,<br>
> > 474M Buf, 375M Free Swap: 48G Total, 48G Free<br>
> ><br>
> > hw.physmem: 8463925248<br>
> > hw.usermem: 7502598144<br>
> > hw.realmem: 8589934592<br>
> ><br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 total=C2=A0 =C2=
=A0 =C2=A0 =C2=A0used=C2=A0 =C2=A0 =C2=A0 =C2=A0free=C2=A0 =C2=A0 =C2=A0sha=
red<br>
> > buffers=C2=A0 =C2=A0 =C2=A0cached Mem:=C2=A0 =C2=A0 =C2=A0 =C2=A0=
8030732=C2=A0 =C2=A0 3587088<br>
> > 4443644=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A0 =C2=A0 =
=C2=A0 =C2=A0 0=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0 Swap:<br>
> > 50331644=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A050331644=
<br>
> ><br>
> > swapinfo:<br>
> ><br>
> > Device=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 1K-blocks=C2=A0 =C2=A0 =
=C2=A0Used=C2=A0 =C2=A0 Avail Capacity<br>
> > /dev/ada0s1b=C2=A0 =C2=A0 =C2=A050331644=C2=A0 =C2=A0 =C2=A0 =C2=
=A0 0 50331644=C2=A0 =C2=A0 =C2=A00%<br>
> ><br>
> > vmstat:<br>
> ><br>
> > procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks=
<br>
> > faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0cpu r b w=C2=A0 =C2=A0 =
=C2=A0avm=C2=A0 =C2=A0 =C2=A0fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po<br>
> > fr=C2=A0 =C2=A0sr ad0 pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =
=C2=A0 cs us sy id 1 0 0 31449076<br>
> > 384420 1902=C2=A0 =C2=A09=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 1392=
=C2=A0 861=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 222 15579=C2=A0 5778<br>
> > 14 5 82<br>
> ><br>
> > -----BEGIN PGP SIGNATURE-----<br>
> ><br>
> > iF0EARECAB0WIQQxRId2q5JPHFiozTr5X9dS0HpoEAUCXao+5gAKCRD5X9dS0Hpo<=
br>
> > EOyNAJ4pUcQHIpLxnd+pLuGS8fKL02HRbACgmfoIR22ub7kGannIpdUvjGVs2pI=
=3D<br>
> > =3DsFDL<br>
> > -----END PGP SIGNATURE-----<br>
> ><br>
-----BEGIN PGP SIGNATURE-----<br>
<br>
iF0EARECAB0WIQQxRId2q5JPHFiozTr5X9dS0HpoEAUCXapuIgAKCRD5X9dS0Hpo<br>
EO/IAKCho+xNiMpYiG3A1DCqUWqNRmlXvQCgqyC85nemHWaKMZzvWt3ldEcTVg8=3D<br>
=3DU/My<br>
-----END PGP SIGNATURE-----<br>
</blockquote></div>
--00000000000010311305953a6102--
- Raw text -