Mail Archives: geda-help/2019/10/20/12:29:52
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| Sun, 20 Oct 2019 09:14:47 -0700 (PDT)
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| References: | <20191018223829 DOT 6ad6ca73fb2d77c5f389399e AT gmail DOT com>
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| In-Reply-To: | <CAHUm0tM+R8PORa+US2Nt0Q1vaU80YcG9AEyH8XWUVODJAV09aA@mail.gmail.com>
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| From: | "Chad Parker (parker DOT charles AT gmail DOT com) [via geda-help AT delorie DOT com]" <geda-help AT delorie DOT com>
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| Date: | Sun, 20 Oct 2019 12:14:36 -0400
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| Message-ID: | <CAJZxidBbky8CT7mcRa1DX_pZTLnf=x2x0Hh4CiX122F-F_c1Vw@mail.gmail.com>
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| Subject: | Re: [geda-help] Question: New User - How To Create Very Simple Unique
|
| PCB With No Components
|
| To: | geda-help AT delorie DOT com
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| Reply-To: | geda-help AT delorie DOT com
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--000000000000b4c352059559dd64
Content-Type: text/plain; charset="UTF-8"
Hi John-
If the board thickness is important to you, you'll definitely want to talk
to the manufacturer before they build it. Most shops (well, some at least)
have a variety of different thickness substrates that they can use. You'll
want to have a chat with their manufacturing engineer to see what options
are available. Then if the capacitance value is important to you, you will
likely need to tailor your copper area to fine tune it to whatever
thickness they can provide.
Depending on how much variation you can tolerate, there are several other
thing you can consider.
As Erich points out, FR4 is not a particularly consistent dielectric. You
may want to try something like Polyimide that is more consistent and less
sensitive to temperature.
You could also consider breaking your large area into segments connected by
small traces. Build in extra area so the capacitance is greater than you
want, and then you can tune it down by cutting some of those connecting
traces to reduce the effective area. These extra areas could be large or
small depending on how much tuning you want to do.
You can do all of these things quite easily in pcb. Use the rectangle tool
to draw your copper areas on the top and bottom layers. Your holes can be
created using the pin/via tool, with a copper area that's smaller than the
drill size. If you want holes that aren't circular, then you can draw
outlines of those shapes on the outline layer using the line and arc tools.
If your application doesn't have anything that is rubbing on the PCB, then
soldermask is an effective insulator at low voltages (maybe, say, < 25 V?).
You wouldn't have to bother with a third layer.
To make connections, you can just add two pins and connect one to each of
the two planes. You'll definitely want to use thermals as those large
copper areas will sink a lot of heat. Select the thermal tool and click the
pin. Then you can cycle through different connectivity options by holding
one of the modifier keys and clicking again (I think it's <shift> off the
top of my head).
Let me know if you have any trouble.
--Chad
On Fri, Oct 18, 2019 at 11:06 PM Erich Heinzle (a1039181 AT gmail DOT com) [via
geda-help AT delorie DOT com] <geda-help AT delorie DOT com> wrote:
> A few thoughts...
>
> The characteristics of FR4 can vary depending on temperature, humidity and
> frequency of operation.
>
> The manufacturer may not be able to do the exact thickness you need.
>
> Yes, a via would allow connection to copper on the underside to tracks on
> the top layer
>
> Regards,
>
> Erich
>
> On Sat, 19 Oct 2019 12:55 John L. Males (jlmales AT gmail DOT com) [via
> geda-help AT delorie DOT com], <geda-help AT delorie DOT com> wrote:
>
>> -----BEGIN PGP SIGNED MESSAGE-----
>> Hash: SHA1
>>
>> Eric,
>>
>> Thanks for your reply.
>>
>> I hope I am replying in the correct manner for the mailing list.
>>
>> I left out some elements on purpose not aware of possible
>> suggestion to stack the PCBs.
>>
>> I cannot stack two PCBs for thickness reasons that are actually
>> specific for the this simple PCB board. The thickness of the
>> board will need to be about 0.79mm. As indicated PCB thickness
>> is specified when board is made and not in the PCB software.
>>
>> I thought is would be simple to have a copper plane on both
>> sides of board and to include holes in this simple PCB. The
>> simple PCB board is a capacitor based on copper surface area
>> minus the holes that need to be there to allow air to
>> freely move due to the plates on either side of the simple PCB
>> I want to make. The PCB I want to make needs a 0.79mm gap
>> between the two copper planes of the PCB, ergo a PCB
>> thickness of about 0.79mm.
>>
>> The copper area will be about the middle 80% (off top of my
>> head). I have not calculated the exact surface area of the two
>> copper planes yet. The minimum board span will be 4 inches
>> minus about 1.25 inches for the combined sides the board is
>> mounted on and the gap of the moving plates this PCB will be
>> sandwiched between.
>>
>> I indicated minimum board span as I may want to add about 0.75
>> inches to one side of the PCB length to overhang on one side of
>> the span points. This to allow easy access and clearance for
>> connectors if I choose to design for connectors. A soldered to
>> board wires via solder pads that will not need any board
>> overhang.
>>
>> In essence I need two layers, but thought it might be useful
>> for third layer that runs inside the board that brings traces
>> out from each copper plane. The intent was to make it easy for
>> the lead out traces not to short on the aluminum block at the
>> end where the connections are made to the PCB via wires or
>> connectors.
>>
>> Maybe I have to consider adding thin coat of varathane to
>> insulate the lower trace to a top trace transition for
>> connection of wires via pad or connectors. The top side of the
>> board is not in contact with any metal. Might that present a
>> way to transition the lower plane of copper to an upper trace?
>> Is a via the correct term/approach to allow? I can ensure the
>> is a bit of gap and enough clearance from the aluminum
>> mounting block for a via or what it needed to transition a
>> bottom trace/copper to upper trace for solder pad or connector.
>>
>> If it is useful I could see if I can create an image of both
>> sides of board with a drawing program. I am not certain if I
>> can, but I can see if that helps clarify my attempt to
>> articulate what I am trying to do.
>>
>>
>> John L. Males
>> Toronto, Ontario
>> Canada
>> 18 October 2019 22:00 -0400 EDT
>>
>>
>> ================================================================
>>
>> 2019-10-19 01:25:11+0000-UTC Time: 1571448311 PC/System time
>>
>> 19 Oct 01:25:11 ntpdate[15820]: ntpdate 4.2.8p12-a (1)
>>
>> 19 Oct 01:25:26 ntpdate[17068]: step time server 206.108.0.132
>> offset 0.001708 sec
>>
>> FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul 11
>> 16:13:47 UTC 2019
>> root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC
>>
>> (Work in progress alternative to Linux Kernel of its own right,
>> Debian, and
>> other Linux based Kernel distributions determined.)
>>
>> Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
>> Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class
>> CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz
>> K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
>> (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @
>> 1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M
>> CPU @ 1.40GHz (1396.86-MHz K8-class CPU)
>>
>> dev.cpu.0.temperature: 69.0C
>> dev.cpu.1.temperature: 68.0C
>> dev.cpu.2.temperature: 64.0C
>> dev.cpu.3.temperature: 64.0C
>> hw.acpi.thermal.tz0.temperature: 69.1C
>>
>> vmstat -s:
>>
>> 188317092 cpu context switches
>> 7044759 device interrupts
>> 1014980 software interrupts
>> 51267914 traps
>> 479658084 system calls
>> 27 kernel threads created
>> 3253 fork() calls
>> 1051 vfork() calls
>> 0 rfork() calls
>> 0 swap pager pageins
>> 0 swap pager pages paged in
>> 0 swap pager pageouts
>> 0 swap pager pages paged out
>> 8798 vnode pager pageins
>> 122396 vnode pager pages paged in
>> 322 vnode pager pageouts
>> 3527 vnode pager pages paged out
>> 11 page daemon wakeups
>> 29799537 pages examined by the page daemon
>> 0 clean page reclamation shortfalls
>> 369964 pages reactivated by the page daemon
>> 528547 copy-on-write faults
>> 9933 copy-on-write optimized faults
>> 33166324 zero fill pages zeroed
>> 25991 zero fill pages prezeroed
>> 1622 intransit blocking page faults
>> 52124252 total VM faults taken
>> 12676 page faults requiring I/O
>> 0 pages affected by kernel thread creation
>> 373301 pages affected by fork()
>> 36978 pages affected by vfork()
>> 0 pages affected by rfork()
>> 37526757 pages freed
>> 308705 pages freed by daemon
>> 17242344 pages freed by exiting processes
>> 473888 pages active
>> 1014069 pages inactive
>> 208348 pages in the laundry queue
>> 250554 pages wired down
>> 60872 pages free
>> 4096 bytes per page
>> 3737378 total name lookups
>> cache hits (93% pos + 4% neg) system 0% per-directory
>> deletions 0%, falsehits 0%, toolong 0%
>>
>> Boot time : 1571414099
>>
>> procs memory page disks
>> faults cpu0 cpu1 cpu2 cpu3 r b w avm
>> fre flt re pi po fr sr ad0 pa0 in sy cs us sy
>> id us sy id us sy id us sy id 0 0 0 32149200 243428 1523 11
>> 0 0 1096 871 0 0 206 14014 5502 11 7 82 12 4 84 12
>> 3 84 12 3 84
>>
>> memory info:
>>
>> real memory = 8589934592 (8192 MB)
>> avail memory = 8166465536 (7788 MB)
>>
>> last pid: 23225; load averages: 1.41, 0.92, 0.69 up
>> 0+09:30:27 01:25:26 60 processes: 1 running, 59 sleeping
>>
>> Mem: 1852M Active, 3961M Inact, 814M Laundry, 979M Wired, 510M
>> Buf, 237M Free Swap: 48G Total, 48G Free
>>
>> hw.physmem: 8463925248
>> hw.usermem: 7437496320
>> hw.realmem: 8589934592
>>
>> total used free shared
>> buffers cached Mem: 8030732 3731096
>> 4299636 0 0 0 Swap:
>> 50331644 0 50331644
>>
>> swapinfo:
>>
>> Device 1K-blocks Used Avail Capacity
>> /dev/ada0s1b 50331644 0 50331644 0%
>>
>> vmstat:
>>
>> procs memory page disks
>> faults cpu r b w avm fre flt re pi po
>> fr sr ad0 pa0 in sy cs us sy id 0 0 0 32149200
>> 243400 1523 11 0 0 1096 871 0 0 206 14014 5502 12
>> 4 84
>>
>>
>> Message replied to:
>>
>> Date: Sat, 19 Oct 2019 11:12:00 +1030
>> From: "Erich Heinzle (a1039181 AT gmail DOT com) [via
>> geda-help AT delorie DOT com]" <geda-help AT delorie DOT com> To: "Vladimir
>> Zhbanov (vzhbanov AT gmail DOT com) [via geda-help AT delorie DOT com]"
>> <geda-help AT delorie DOT com> Subject: Re: [geda-help] Question: New
>> User - How To Create Very Simple Unique PCB With No Components
>>
>>
>> > The PCB thickness is usually selected at the time of ordering
>> > the board from the manufacturer.
>> >
>> > Routine FR4 is 1.6mm thick, with 1 or 2 oz per square foot of
>> > copper for the front and back planes.
>> >
>> > The next option up from double sided is 4 layer boards, which
>> > are quite a bit more expensive.
>> >
>> > My approach to your board stack up would be to make two
>> > double sided boards which have fairly full copper coverage on
>> > their bottom layers and then get stacked one on top of the
>> > other, with the full copper planes outermost. You can then
>> > make any holes in the two boards correspond for all the way
>> > through perforations, or not, for part way perforations into
>> > the middle layer(s) section for access to any trackwork.
>> >
>> > Attention to registration marks, (maybe using some drill
>> > holes for mountung hardware for this) would be important.
>> >
>> > Apertures on a board are defined with the outline layer, and
>> > need to take account of a milling cutter's typically 0.8mm
>> > diameter, and the centres of the lines on the outline layer
>> > for apertures define the path of the cutter's outer radius.
>> >
>> > If you need slots, or windowing of solder mask layers, it may
>> > be easier to do the board in pcb-rnd, which supports slots,
>> > as well as arbitrary negative apertures on the solder mask
>> > layer, which may be necessary, depending on your plans for
>> > exposure of the inner and outer layer copper areas.
>> >
>> > You could do most of the above as a four layer board, by
>> > censoring/eliminating one of the internal layers, but you may
>> > be paying a lot to do this, and may struggle to get the
>> > openings you want communicated effectively to the board
>> > fabricator.
>> >
>> > Regards,
>> >
>> > Erich
>> >
>> > On Sat, 19 Oct 2019 09:34 John L. Males (jlmales AT gmail DOT com)
>> > [via geda-help AT delorie DOT com], <geda-help AT delorie DOT com> wrote:
>> >
>> > > -----BEGIN PGP SIGNED MESSAGE-----
>> > > Hash: SHA1
>> > >
>> > > Hello,
>> > >
>> > > This is my first posting here. I do not know if the mailing
>> > > list will automatically eMail me a reply. I have looked at
>> > > the mailing list commands and options I cannot find if and
>> > > how I may set if replies to me or others can be set.
>> > >
>> > > I am new to PCB software, but have reasonable average
>> > > electronics skills over a number of years.
>> > >
>> > > I have a simple and unique challenge I have tried many
>> > > different ways to figure out. I have done alot of internet
>> > > searching, looked at many tutorials, and tried using PCB
>> > > based on tutorials and my own exploring about PCB to find
>> > > how I do this simple and unique PCB.
>> > >
>> > > I need to create a PCB that has a copper plane on top and
>> > > bottom of the PCB. That simple. No components. It is
>> > > likely via a third layer between the top and bottom copper
>> > > planes I will want traces out to holes I may make as solder
>> > > tabs or us a connector of some type. The reason for the
>> > > trace connections as a third layer is to ensure the traces
>> > > do not short with the aluminum parts metal part the PCB has
>> > > to be mounted to directly at each end of the PCB.
>> > >
>> > > Then I will need to create a set of holes in the parallel
>> > > copper planes area whose sole purpose is to let air pass
>> > > between and not be a connection between the top and bottom
>> > > copper planes.
>> > >
>> > > If I need to specify a PCB thickness then how I do so. So
>> > > far I have not been able to find a setting/preference for
>> > > the PCB thickness to do so.
>> > >
>> > > The how to do the connector and/or solder tab is not
>> > > critical to the primary question. I will try to figure
>> > > that out after I have the most important part of the PCB as
>> > > noted above done in PCB.
>> > >
>> > > I will need to do a second PCB, but it will have lots of
>> > > components on it. I would need to enter the schematic
>> > > first of curse. I suspect I will manage with the help
>> > > examples I have already read and will read again when I am
>> > > ready to create a PCB from the schematic.
>> > >
>> > > If there is any missing part of the information to my core
>> > > question of copper planes on top/bottom and holes in the
>> > > copper plane that do not connect the top and bottom copper
>> > > planes feel free to ask or comment on.
>> > >
>> > >
>> > > John L. Males
>> > > Toronto, Ontario
>> > > Canada
>> > > 18 October 2019 18:38 -0400 EDT
>> > >
>> > >
>> > > ================================================================
>> > >
>> > > 2019-10-18 22:05:20+0000-UTC Time: 1571436320 PC/System time
>> > >
>> > > 18 Oct 22:05:20 ntpdate[85789]: ntpdate 4.2.8p12-a (1)
>> > >
>> > > 18 Oct 22:05:35 ntpdate[87775]: step time server
>> > > 206.108.0.131 offset -0.004716 sec
>> > >
>> > > FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul
>> > > 11 16:13:47 UTC 2019
>> > > root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC
>> > >
>> > > (Work in progress alternative to Linux Kernel of its own
>> > > right, Debian, and
>> > > other Linux based Kernel distributions determined.)
>> > >
>> > > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
>> > > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz
>> > > K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz
>> > > (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @
>> > > 1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM)
>> > > i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU) Intel(R)
>> > > Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU)
>> > >
>> > > dev.cpu.0.temperature: 71.0C
>> > > dev.cpu.1.temperature: 70.0C
>> > > dev.cpu.2.temperature: 66.0C
>> > > dev.cpu.3.temperature: 66.0C
>> > > hw.acpi.thermal.tz0.temperature: 72.1C
>> > >
>> > > vmstat -s:
>> > >
>> > > 128476253 cpu context switches
>> > > 4928508 device interrupts
>> > > 661878 software interrupts
>> > > 41825629 traps
>> > > 346413636 system calls
>> > > 27 kernel threads created
>> > > 3000 fork() calls
>> > > 793 vfork() calls
>> > > 0 rfork() calls
>> > > 0 swap pager pageins
>> > > 0 swap pager pages paged in
>> > > 0 swap pager pageouts
>> > > 0 swap pager pages paged out
>> > > 8688 vnode pager pageins
>> > > 120478 vnode pager pages paged in
>> > > 322 vnode pager pageouts
>> > > 3527 vnode pager pages paged out
>> > > 3 page daemon wakeups
>> > > 19153450 pages examined by the page daemon
>> > > 0 clean page reclamation shortfalls
>> > > 198910 pages reactivated by the page daemon
>> > > 502073 copy-on-write faults
>> > > 9226 copy-on-write optimized faults
>> > > 27520777 zero fill pages zeroed
>> > > 24413 zero fill pages prezeroed
>> > > 1622 intransit blocking page faults
>> > > 42301697 total VM faults taken
>> > > 12576 page faults requiring I/O
>> > > 0 pages affected by kernel thread creation
>> > > 357307 pages affected by fork()
>> > > 28026 pages affected by vfork()
>> > > 0 pages affected by rfork()
>> > > 30941382 pages freed
>> > > 89018 pages freed by daemon
>> > > 13777017 pages freed by exiting processes
>> > > 470801 pages active
>> > > 1014759 pages inactive
>> > > 191320 pages in the laundry queue
>> > > 234660 pages wired down
>> > > 96191 pages free
>> > > 4096 bytes per page
>> > > 3108988 total name lookups
>> > > cache hits (93% pos + 4% neg) system 0%
>> > > per-directory deletions 0%, falsehits 0%, toolong 0%
>> > >
>> > > Boot time : 1571414099
>> > >
>> > > procs memory page disks
>> > > faults cpu0 cpu1 cpu2 cpu3 r b w avm
>> > > fre flt re pi po fr sr ad0 pa0 in sy cs us
>> > > sy id us sy id us sy id us sy id 0 0 0 31449076 384704
>> > > 1902 9 0 0 1391 861 0 0 222 15578 5778 12 8 80
>> > > 14 4 82 14 4 82 14 4 82
>> > >
>> > > memory info:
>> > >
>> > > real memory = 8589934592 (8192 MB)
>> > > avail memory = 8166465536 (7788 MB)
>> > >
>> > > last pid: 92816; load averages: 0.46, 0.66, 0.83 up
>> > > 0+06:10:37 22:05:36 56 processes: 1 running, 55 sleeping
>> > >
>> > > Mem: 1840M Active, 3964M Inact, 747M Laundry, 917M Wired,
>> > > 474M Buf, 375M Free Swap: 48G Total, 48G Free
>> > >
>> > > hw.physmem: 8463925248
>> > > hw.usermem: 7502598144
>> > > hw.realmem: 8589934592
>> > >
>> > > total used free shared
>> > > buffers cached Mem: 8030732 3587088
>> > > 4443644 0 0 0 Swap:
>> > > 50331644 0 50331644
>> > >
>> > > swapinfo:
>> > >
>> > > Device 1K-blocks Used Avail Capacity
>> > > /dev/ada0s1b 50331644 0 50331644 0%
>> > >
>> > > vmstat:
>> > >
>> > > procs memory page disks
>> > > faults cpu r b w avm fre flt re pi po
>> > > fr sr ad0 pa0 in sy cs us sy id 1 0 0 31449076
>> > > 384420 1902 9 0 0 1392 861 0 0 222 15579 5778
>> > > 14 5 82
>> > >
>> > > -----BEGIN PGP SIGNATURE-----
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>> > > =sFDL
>> > > -----END PGP SIGNATURE-----
>> > >
>> -----BEGIN PGP SIGNATURE-----
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>>
>
--000000000000b4c352059559dd64
Content-Type: text/html; charset="UTF-8"
Content-Transfer-Encoding: quoted-printable
<div dir=3D"ltr"><div>Hi John-</div><div><br></div><div>If the board thickn=
ess is important to you, you'll definitely want to talk to the manufact=
urer before they build it. Most shops (well, some at least) have a variety =
of different thickness substrates that they can use. You'll want to hav=
e a chat with their manufacturing engineer to see what options are availabl=
e. Then if the capacitance value is important to you, you will likely need =
to tailor your copper area to fine tune it to whatever thickness they can p=
rovide. <br></div><div><br></div><div>Depending on how much variation you c=
an tolerate, there are several other thing you can consider. <br></div><div=
><br></div><div>As Erich points out, FR4 is not a particularly consistent d=
ielectric. You may want to try something like Polyimide that is more consis=
tent and less sensitive to temperature.</div><div><br></div><div>You could =
also consider breaking your large area into segments connected by small tra=
ces. Build in extra area so the capacitance is greater than you want, and t=
hen you can tune it down by cutting some of those connecting traces to redu=
ce the effective area. These extra areas could be large or small depending =
on how much tuning you want to do.<br></div><div><br></div><div>You can do =
all of these things quite easily in pcb. Use the rectangle tool to draw you=
r copper areas on the top and bottom layers. Your holes can be created usin=
g the pin/via tool, with a copper area that's smaller than the drill si=
ze. If you want holes that aren't circular, then you can draw outlines =
of those shapes on the outline layer using the line and arc tools.</div><di=
v><br></div><div>If your application doesn't have anything that is rubb=
ing on the PCB, then soldermask is an effective insulator at low voltages (=
maybe, say, < 25 V?). You wouldn't have to bother with a third layer=
. <br></div><div><br></div><div>To make connections, you can just add two p=
ins and connect one to each of the two planes. You'll definitely want t=
o use thermals as those large copper areas will sink a lot of heat. Select =
the thermal tool and click the pin. Then you can cycle through different co=
nnectivity options by holding one of the modifier keys and clicking again (=
I think it's <shift> off the top of my head).<br></div><div><br><=
/div><div>Let me know if you have any trouble.</div><div>--Chad<br></div><d=
iv><br></div></div><br><div class=3D"gmail_quote"><div dir=3D"ltr" class=3D=
"gmail_attr">On Fri, Oct 18, 2019 at 11:06 PM Erich Heinzle (<a href=3D"mai=
lto:a1039181 AT gmail DOT com" target=3D"_blank">a1039181 AT gmail DOT com</a>) [via <a h=
ref=3D"mailto:geda-help AT delorie DOT com" target=3D"_blank">geda-help AT delorie DOT co=
m</a>] <<a href=3D"mailto:geda-help AT delorie DOT com" target=3D"_blank">geda-=
help AT delorie DOT com</a>> wrote:<br></div><blockquote class=3D"gmail_quote" =
style=3D"margin:0px 0px 0px 0.8ex;border-left:1px solid rgb(204,204,204);pa=
dding-left:1ex"><div dir=3D"auto">A few thoughts...<div dir=3D"auto"><br></=
div><div dir=3D"auto">The characteristics of FR4 can vary depending on temp=
erature, humidity and frequency of operation.<div dir=3D"auto"><br></div><d=
iv dir=3D"auto">The manufacturer may not be able to do the exact thickness =
you need.</div><div dir=3D"auto"><br></div><div dir=3D"auto">Yes, a via wou=
ld allow connection to copper on the underside to tracks on the top layer</=
div><div dir=3D"auto"><br></div><div dir=3D"auto">Regards,</div><div dir=3D=
"auto"><br></div><div dir=3D"auto">Erich</div></div></div><br><div class=3D=
"gmail_quote"><div dir=3D"ltr" class=3D"gmail_attr">On Sat, 19 Oct 2019 12:=
55 John L. Males (<a href=3D"mailto:jlmales AT gmail DOT com" target=3D"_blank">jl=
males AT gmail DOT com</a>) [via <a href=3D"mailto:geda-help AT delorie DOT com" target=
=3D"_blank">geda-help AT delorie DOT com</a>], <<a href=3D"mailto:geda-help AT del=
orie.com" target=3D"_blank">geda-help AT delorie DOT com</a>> wrote:<br></div><=
blockquote class=3D"gmail_quote" style=3D"margin:0px 0px 0px 0.8ex;border-l=
eft:1px solid rgb(204,204,204);padding-left:1ex">-----BEGIN PGP SIGNED MESS=
AGE-----<br>
Hash: SHA1<br>
<br>
Eric,<br>
<br>
Thanks for your reply.<br>
<br>
I hope I am replying in the correct manner for the mailing list.<br>
<br>
I left out some elements on purpose not aware of possible<br>
suggestion to stack the PCBs.<br>
<br>
I cannot stack two PCBs for thickness reasons that are actually<br>
specific for the this simple PCB board.=C2=A0 The thickness of the<br>
board will need to be about 0.79mm.=C2=A0 As indicated PCB thickness<br>
is specified when board is made and not in the PCB software.<br>
<br>
I thought is would be simple to have a copper plane on both<br>
sides of board and to include holes in this simple PCB.=C2=A0 The<br>
simple PCB board is a capacitor based on copper surface area<br>
minus the holes that need to be there to allow air to<br>
freely move due to the plates on either side of the simple PCB<br>
I want to make.=C2=A0 The PCB I want to make needs a 0.79mm gap<br>
between the two copper planes of the PCB, ergo a PCB<br>
thickness of about 0.79mm.<br>
<br>
The copper area will be about the middle 80% (off top of my<br>
head). I have not calculated the exact surface area of the two<br>
copper planes yet.=C2=A0 The minimum board span will be 4 inches<br>
minus about 1.25 inches for the combined sides the board is<br>
mounted on and the gap of the moving plates this PCB will be<br>
sandwiched between.<br>
<br>
I indicated minimum board span as I may want to add about 0.75<br>
inches to one side of the PCB length to overhang on one side of<br>
the span points.=C2=A0 This to allow easy access and clearance for<br>
connectors if I choose to design for connectors.=C2=A0 A soldered to<br>
board wires via solder pads that will not need any board<br>
overhang.<br>
<br>
In essence I need two layers, but thought it might be useful<br>
for third layer that runs inside the board that brings traces<br>
out from each copper plane.=C2=A0 The intent was to make it easy for<br>
the lead out traces not to short on the aluminum block at the<br>
end where the connections are made to the PCB via wires or<br>
connectors.<br>
<br>
Maybe I have to consider adding thin coat of varathane to<br>
insulate the lower trace to a top trace transition for<br>
connection of wires via pad or connectors.=C2=A0 The top side of the<br>
board is not in contact with any metal.=C2=A0 Might that present a<br>
way to transition the lower plane of copper to an upper trace?<br>
Is a via the correct term/approach to allow?=C2=A0 I can ensure the<br>
is a bit of gap and enough clearance from the aluminum<br>
mounting block for a via or what it needed to transition a<br>
bottom trace/copper to upper trace for solder pad or connector.<br>
<br>
If it is useful I could see if I can create an image of both<br>
sides of board with a drawing program.=C2=A0 I am not certain if I<br>
can, but I can see if that helps clarify my attempt to<br>
articulate what I am trying to do.<br>
<br>
<br>
John L. Males<br>
Toronto, Ontario<br>
Canada<br>
18 October 2019 22:00 -0400 EDT<br>
<br>
<br>
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D<br>
<br>
2019-10-19 01:25:11+0000-UTC Time: 1571448311 PC/System time<br>
<br>
19 Oct 01:25:11 ntpdate[15820]: ntpdate 4.2.8p12-a (1)<br>
<br>
19 Oct 01:25:26 ntpdate[17068]: step time server 206.108.0.132<br>
offset 0.001708 sec<br>
<br>
FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul 11<br>
16:13:47 UTC 2019<br>
root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC <br>
<br>
(Work in progress alternative to Linux Kernel of its own right,<br>
=C2=A0Debian, and<br>
=C2=A0other Linux based Kernel distributions determined.)<br>
<br>
Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class<br>
CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz<br>
K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
(1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @<br>
1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M<br>
CPU @ 1.40GHz (1396.86-MHz K8-class CPU)<br>
<br>
dev.cpu.0.temperature: 69.0C<br>
dev.cpu.1.temperature: 68.0C<br>
dev.cpu.2.temperature: 64.0C<br>
dev.cpu.3.temperature: 64.0C<br>
hw.acpi.thermal.tz0.temperature: 69.1C<br>
<br>
vmstat -s:<br>
<br>
188317092 cpu context switches<br>
=C2=A0 7044759 device interrupts<br>
=C2=A0 1014980 software interrupts<br>
=C2=A051267914 traps<br>
479658084 system calls<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A027 kernel threads created<br>
=C2=A0 =C2=A0 =C2=A03253=C2=A0 fork() calls<br>
=C2=A0 =C2=A0 =C2=A01051 vfork() calls<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 rfork() calls<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pageins<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pages paged in<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pageouts<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 swap pager pages paged out<br>
=C2=A0 =C2=A0 =C2=A08798 vnode pager pageins<br>
=C2=A0 =C2=A0122396 vnode pager pages paged in<br>
=C2=A0 =C2=A0 =C2=A0 322 vnode pager pageouts<br>
=C2=A0 =C2=A0 =C2=A03527 vnode pager pages paged out<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A011 page daemon wakeups<br>
=C2=A029799537 pages examined by the page daemon<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 clean page reclamation shortfalls<br>
=C2=A0 =C2=A0369964 pages reactivated by the page daemon<br>
=C2=A0 =C2=A0528547 copy-on-write faults<br>
=C2=A0 =C2=A0 =C2=A09933 copy-on-write optimized faults<br>
=C2=A033166324 zero fill pages zeroed<br>
=C2=A0 =C2=A0 25991 zero fill pages prezeroed<br>
=C2=A0 =C2=A0 =C2=A01622 intransit blocking page faults<br>
=C2=A052124252 total VM faults taken<br>
=C2=A0 =C2=A0 12676 page faults requiring I/O<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 pages affected by kernel thread creation<br>
=C2=A0 =C2=A0373301 pages affected by=C2=A0 fork()<br>
=C2=A0 =C2=A0 36978 pages affected by vfork()<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 pages affected by rfork()<br>
=C2=A037526757 pages freed<br>
=C2=A0 =C2=A0308705 pages freed by daemon<br>
=C2=A017242344 pages freed by exiting processes<br>
=C2=A0 =C2=A0473888 pages active<br>
=C2=A0 1014069 pages inactive<br>
=C2=A0 =C2=A0208348 pages in the laundry queue<br>
=C2=A0 =C2=A0250554 pages wired down<br>
=C2=A0 =C2=A0 60872 pages free<br>
=C2=A0 =C2=A0 =C2=A04096 bytes per page<br>
=C2=A0 3737378 total name lookups<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 cache hits (93% pos + 4% neg) system 0% =
per-directory<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 deletions 0%, falsehits 0%, toolong 0%<b=
r>
<br>
Boot time : 1571414099<br>
<br>
procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=C2=A0 =C2=
=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks<br>
faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 cpu0=C2=A0 =C2=A0 =C2=A0cpu1=C2=A0 =C2=A0=
=C2=A0cpu2=C2=A0 =C2=A0 =C2=A0cpu3 r b w=C2=A0 =C2=A0 =C2=A0avm<br>
fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po=C2=A0 =C2=A0 fr=C2=A0 =C2=A0sr ad0=
pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =C2=A0 cs us sy<br>
id us sy id us sy id us sy id 0 0 0 32149200=C2=A0 243428 1523=C2=A0 11<br>
0=C2=A0 =C2=A00=C2=A0 1096=C2=A0 871=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 206 =
14014=C2=A0 5502 11=C2=A0 7 82 12=C2=A0 4 84 12<br>
3 84 12=C2=A0 3 84<br>
<br>
memory info:<br>
<br>
real memory=C2=A0 =3D 8589934592 (8192 MB)<br>
avail memory =3D 8166465536 (7788 MB)<br>
<br>
last pid: 23225;=C2=A0 load averages:=C2=A0 1.41,=C2=A0 0.92,=C2=A0 0.69=C2=
=A0 up<br>
0+09:30:27=C2=A0 =C2=A0 01:25:26 60 processes:=C2=A0 1 running, 59 sleeping=
<br>
<br>
Mem: 1852M Active, 3961M Inact, 814M Laundry, 979M Wired, 510M<br>
Buf, 237M Free Swap: 48G Total, 48G Free<br>
<br>
hw.physmem: 8463925248<br>
hw.usermem: 7437496320<br>
hw.realmem: 8589934592<br>
<br>
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0total=C2=A0 =C2=A0 =C2=A0 =
=C2=A0used=C2=A0 =C2=A0 =C2=A0 =C2=A0free=C2=A0 =C2=A0 =C2=A0shared<br>
buffers=C2=A0 =C2=A0 =C2=A0cached Mem:=C2=A0 =C2=A0 =C2=A0 =C2=A08030732=C2=
=A0 =C2=A0 3731096<br>
4299636=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=
=A0 0=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0 Swap:<br>
50331644=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A050331644<br>
<br>
swapinfo:<br>
<br>
Device=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 1K-blocks=C2=A0 =C2=A0 =C2=A0Used=
=C2=A0 =C2=A0 Avail Capacity<br>
/dev/ada0s1b=C2=A0 =C2=A0 =C2=A050331644=C2=A0 =C2=A0 =C2=A0 =C2=A0 0 50331=
644=C2=A0 =C2=A0 =C2=A00%<br>
<br>
vmstat:<br>
<br>
procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=C2=A0 =C2=
=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks<br>
faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0cpu r b w=C2=A0 =C2=A0 =C2=A0avm=C2=
=A0 =C2=A0 =C2=A0fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po<br>
fr=C2=A0 =C2=A0sr ad0 pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =C2=A0 cs us=
sy id 0 0 0 32149200<br>
243400 1523=C2=A0 11=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 1096=C2=A0 871=C2=A0=
=C2=A00=C2=A0 =C2=A00=C2=A0 206 14014=C2=A0 5502 12<br>
4 84<br>
<br>
<br>
Message replied to:<br>
<br>
Date: Sat, 19 Oct 2019 11:12:00 +1030<br>
From: "Erich Heinzle (<a href=3D"mailto:a1039181 AT gmail DOT com" rel=3D"nor=
eferrer" target=3D"_blank">a1039181 AT gmail DOT com</a>) [via<br>
<a href=3D"mailto:geda-help AT delorie DOT com" rel=3D"noreferrer" target=3D"_blan=
k">geda-help AT delorie DOT com</a>]" <<a href=3D"mailto:geda-help AT delorie=
.com" rel=3D"noreferrer" target=3D"_blank">geda-help AT delorie DOT com</a>> To=
: "Vladimir<br>
Zhbanov (<a href=3D"mailto:vzhbanov AT gmail DOT com" rel=3D"noreferrer" target=3D=
"_blank">vzhbanov AT gmail DOT com</a>) [via <a href=3D"mailto:geda-help AT delorie DOT c=
om" rel=3D"noreferrer" target=3D"_blank">geda-help AT delorie DOT com</a>]"<b=
r>
<<a href=3D"mailto:geda-help AT delorie DOT com" rel=3D"noreferrer" target=3D"_=
blank">geda-help AT delorie DOT com</a>> Subject: Re: [geda-help] Question: New=
<br>
User - How To Create Very Simple Unique PCB With No Components<br>
<br>
<br>
> The PCB thickness is usually selected at the time of ordering<br>
> the board from the manufacturer.<br>
> <br>
> Routine FR4 is 1.6mm thick, with 1 or 2 oz per square foot of<br>
> copper for the front and back planes.<br>
> <br>
> The next option up from double sided is 4 layer boards, which<br>
> are quite a bit more expensive.<br>
> <br>
> My approach to your board stack up would be to make two<br>
> double sided boards which have fairly full copper coverage on<br>
> their bottom layers and then get stacked one on top of the<br>
> other, with the full copper planes outermost. You can then<br>
> make any holes in the two boards correspond for all the way<br>
> through perforations, or not, for part way perforations into<br>
> the middle layer(s) section for access to any trackwork.<br>
> <br>
> Attention to registration marks, (maybe=C2=A0 using some drill<br>
> holes for mountung hardware for this) would be important.<br>
> <br>
> Apertures on a board are defined with the outline layer, and<br>
> need to take account of a milling cutter's typically 0.8mm<br>
> diameter, and the centres of the lines on the outline layer<br>
> for apertures define the path of the cutter's outer radius.<br>
> <br>
> If you need slots, or windowing of solder mask layers, it may<br>
> be easier to do the board in pcb-rnd, which supports slots,<br>
> as well as arbitrary negative apertures on the solder mask<br>
> layer, which may be necessary, depending on your plans for<br>
> exposure of the inner and outer layer copper areas.<br>
> <br>
> You could do most of the above as a four layer board, by<br>
> censoring/eliminating one of the internal layers, but you may<br>
> be paying a lot to do this, and may struggle to get the<br>
> openings you want communicated effectively to the board<br>
> fabricator.<br>
> <br>
> Regards,<br>
> <br>
> Erich<br>
> <br>
> On Sat, 19 Oct 2019 09:34 John L. Males (<a href=3D"mailto:jlmales AT gma=
il.com" rel=3D"noreferrer" target=3D"_blank">jlmales AT gmail DOT com</a>)<br>
> [via <a href=3D"mailto:geda-help AT delorie DOT com" rel=3D"noreferrer" targe=
t=3D"_blank">geda-help AT delorie DOT com</a>], <<a href=3D"mailto:geda-help AT de=
lorie.com" rel=3D"noreferrer" target=3D"_blank">geda-help AT delorie DOT com</a>&g=
t; wrote:<br>
> <br>
> > -----BEGIN PGP SIGNED MESSAGE-----<br>
> > Hash: SHA1<br>
> ><br>
> > Hello,<br>
> ><br>
> > This is my first posting here.=C2=A0 I do not know if the mailing=
<br>
> > list will automatically eMail me a reply.=C2=A0 I have looked at<=
br>
> > the mailing list commands and options I cannot find if and<br>
> > how I may set if replies to me or others can be set.<br>
> ><br>
> > I am new to PCB software, but have reasonable average<br>
> > electronics skills over a number of years.<br>
> ><br>
> > I have a simple and unique challenge I have tried many<br>
> > different ways to figure out.=C2=A0 I have done alot of internet<=
br>
> > searching, looked at many tutorials, and tried using PCB<br>
> > based on tutorials and my own exploring about PCB to find<br>
> > how I do this simple and unique PCB.<br>
> ><br>
> > I need to create a PCB that has a copper plane on top and<br>
> > bottom of the PCB.=C2=A0 That simple.=C2=A0 No components.=C2=A0 =
It is<br>
> > likely via a third layer between the top and bottom copper<br>
> > planes I will want traces out to holes I may make as solder<br>
> > tabs or us a connector of some type.=C2=A0 The reason for the<br>
> > trace connections as a third layer is to ensure the traces<br>
> > do not short with the aluminum parts metal part the PCB has<br>
> > to be mounted to directly at each end of the PCB.<br>
> ><br>
> > Then I will need to create a set of holes in the parallel<br>
> > copper planes area whose sole purpose is to let air pass<br>
> > between and not be a connection between the top and bottom<br>
> > copper planes.<br>
> ><br>
> > If I need to specify a PCB thickness then how I do so.=C2=A0 So<b=
r>
> > far I have not been able to find a setting/preference for<br>
> > the PCB thickness to do so.<br>
> ><br>
> > The how to do the connector and/or solder tab is not<br>
> > critical to the primary question.=C2=A0 I will try to figure<br>
> > that out after I have the most important part of the PCB as<br>
> > noted above done in PCB.<br>
> ><br>
> > I will need to do a second PCB, but it will have lots of<br>
> > components on it.=C2=A0 I would need to enter the schematic<br>
> > first of curse. I suspect I will manage with the help<br>
> > examples I have already read and will read again when I am<br>
> > ready to create a PCB from the schematic.<br>
> ><br>
> > If there is any missing part of the information to my core<br>
> > question of copper planes on top/bottom and holes in the<br>
> > copper plane that do not connect the top and bottom copper<br>
> > planes feel free to ask or comment on.<br>
> ><br>
> ><br>
> > John L. Males<br>
> > Toronto, Ontario<br>
> > Canada<br>
> > 18 October 2019 18:38 -0400 EDT<br>
> ><br>
> ><br>
> > =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D<br>
> ><br>
> > 2019-10-18 22:05:20+0000-UTC Time: 1571436320 PC/System time<br>
> ><br>
> > 18 Oct 22:05:20 ntpdate[85789]: ntpdate 4.2.8p12-a (1)<br>
> ><br>
> > 18 Oct 22:05:35 ntpdate[87775]: step time server<br>
> > 206.108.0.131 offset -0.004716 sec<br>
> ><br>
> > FreeBSD 11.3-STABLE FreeBSD 11.3-STABLE #0 r349903: Thu Jul<br>
> > 11 16:13:47 UTC 2019<br>
> > root AT releng2 DOT nyi DOT freebsd DOT org:/usr/obj/usr/src/sys/GENERIC<br>
> ><br>
> > (Work in progress alternative to Linux Kernel of its own<br>
> > right, Debian, and<br>
> >=C2=A0 other Linux based Kernel distributions determined.)<br>
> ><br>
> > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
> > Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz<br>
> > K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @ 1.40GHz<br>
> > (1396.86-MHz K8-class CPU) Intel(R) Core(TM) i3-2367M CPU @<br>
> > 1.40GHz (1396.86-MHz K8-class CPU) Intel(R) Core(TM)<br>
> > i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU) Intel(R)<br>
> > Core(TM) i3-2367M CPU @ 1.40GHz (1396.86-MHz K8-class CPU)<br>
> ><br>
> > dev.cpu.0.temperature: 71.0C<br>
> > dev.cpu.1.temperature: 70.0C<br>
> > dev.cpu.2.temperature: 66.0C<br>
> > dev.cpu.3.temperature: 66.0C<br>
> > hw.acpi.thermal.tz0.temperature: 72.1C<br>
> ><br>
> > vmstat -s:<br>
> ><br>
> > 128476253 cpu context switches<br>
> >=C2=A0 =C2=A04928508 device interrupts<br>
> >=C2=A0 =C2=A0 661878 software interrupts<br>
> >=C2=A0 41825629 traps<br>
> > 346413636 system calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 27 kernel threads created<br>
> >=C2=A0 =C2=A0 =C2=A0 3000=C2=A0 fork() calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0793 vfork() calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 rfork() calls<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pageins<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pages paged in<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pageouts<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 swap pager pages paged out<br>
> >=C2=A0 =C2=A0 =C2=A0 8688 vnode pager pageins<br>
> >=C2=A0 =C2=A0 120478 vnode pager pages paged in<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0322 vnode pager pageouts<br>
> >=C2=A0 =C2=A0 =C2=A0 3527 vnode pager pages paged out<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A03 page daemon wakeups<br>
> >=C2=A0 19153450 pages examined by the page daemon<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 clean page reclamation shortfa=
lls<br>
> >=C2=A0 =C2=A0 198910 pages reactivated by the page daemon<br>
> >=C2=A0 =C2=A0 502073 copy-on-write faults<br>
> >=C2=A0 =C2=A0 =C2=A0 9226 copy-on-write optimized faults<br>
> >=C2=A0 27520777 zero fill pages zeroed<br>
> >=C2=A0 =C2=A0 =C2=A024413 zero fill pages prezeroed<br>
> >=C2=A0 =C2=A0 =C2=A0 1622 intransit blocking page faults<br>
> >=C2=A0 42301697 total VM faults taken<br>
> >=C2=A0 =C2=A0 =C2=A012576 page faults requiring I/O<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 pages affected by kernel threa=
d creation<br>
> >=C2=A0 =C2=A0 357307 pages affected by=C2=A0 fork()<br>
> >=C2=A0 =C2=A0 =C2=A028026 pages affected by vfork()<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A00 pages affected by rfork()<br>
> >=C2=A0 30941382 pages freed<br>
> >=C2=A0 =C2=A0 =C2=A089018 pages freed by daemon<br>
> >=C2=A0 13777017 pages freed by exiting processes<br>
> >=C2=A0 =C2=A0 470801 pages active<br>
> >=C2=A0 =C2=A01014759 pages inactive<br>
> >=C2=A0 =C2=A0 191320 pages in the laundry queue<br>
> >=C2=A0 =C2=A0 234660 pages wired down<br>
> >=C2=A0 =C2=A0 =C2=A096191 pages free<br>
> >=C2=A0 =C2=A0 =C2=A0 4096 bytes per page<br>
> >=C2=A0 =C2=A03108988 total name lookups<br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0cache hits (93% pos + 4% =
neg) system 0%<br>
> > per-directory deletions 0%, falsehits 0%, toolong 0%<br>
> ><br>
> > Boot time : 1571414099<br>
> ><br>
> > procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks=
<br>
> > faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 cpu0=C2=A0 =C2=A0 =C2=A0cpu1=C2=
=A0 =C2=A0 =C2=A0cpu2=C2=A0 =C2=A0 =C2=A0cpu3 r b w=C2=A0 =C2=A0 =C2=A0avm<=
br>
> > fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po=C2=A0 =C2=A0 fr=C2=A0 =
=C2=A0sr ad0 pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =C2=A0 cs us<br>
> > sy id us sy id us sy id us sy id 0 0 0 31449076=C2=A0 384704<br>
> > 1902=C2=A0 =C2=A09 0=C2=A0 =C2=A00=C2=A0 1391=C2=A0 861=C2=A0 =C2=
=A00=C2=A0 =C2=A00=C2=A0 222 15578=C2=A0 5778 12=C2=A0 8 80<br>
> > 14=C2=A0 4 82 14 4 82 14=C2=A0 4 82<br>
> ><br>
> > memory info:<br>
> ><br>
> > real memory=C2=A0 =3D 8589934592 (8192 MB)<br>
> > avail memory =3D 8166465536 (7788 MB)<br>
> ><br>
> > last pid: 92816;=C2=A0 load averages:=C2=A0 0.46,=C2=A0 0.66,=C2=
=A0 0.83=C2=A0 up<br>
> > 0+06:10:37=C2=A0 =C2=A0 22:05:36 56 processes:=C2=A0 1 running, 5=
5 sleeping<br>
> ><br>
> > Mem: 1840M Active, 3964M Inact, 747M Laundry, 917M Wired,<br>
> > 474M Buf, 375M Free Swap: 48G Total, 48G Free<br>
> ><br>
> > hw.physmem: 8463925248<br>
> > hw.usermem: 7502598144<br>
> > hw.realmem: 8589934592<br>
> ><br>
> >=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 total=C2=A0 =C2=
=A0 =C2=A0 =C2=A0used=C2=A0 =C2=A0 =C2=A0 =C2=A0free=C2=A0 =C2=A0 =C2=A0sha=
red<br>
> > buffers=C2=A0 =C2=A0 =C2=A0cached Mem:=C2=A0 =C2=A0 =C2=A0 =C2=A0=
8030732=C2=A0 =C2=A0 3587088<br>
> > 4443644=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A0 =C2=A0 =
=C2=A0 =C2=A0 0=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0 Swap:<br>
> > 50331644=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 0=C2=A0 =C2=A050331644=
<br>
> ><br>
> > swapinfo:<br>
> ><br>
> > Device=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 1K-blocks=C2=A0 =C2=A0 =
=C2=A0Used=C2=A0 =C2=A0 Avail Capacity<br>
> > /dev/ada0s1b=C2=A0 =C2=A0 =C2=A050331644=C2=A0 =C2=A0 =C2=A0 =C2=
=A0 0 50331644=C2=A0 =C2=A0 =C2=A00%<br>
> ><br>
> > vmstat:<br>
> ><br>
> > procs=C2=A0 =C2=A0 =C2=A0memory=C2=A0 =C2=A0 =C2=A0 =C2=A0 page=
=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0 disks=
<br>
> > faults=C2=A0 =C2=A0 =C2=A0 =C2=A0 =C2=A0cpu r b w=C2=A0 =C2=A0 =
=C2=A0avm=C2=A0 =C2=A0 =C2=A0fre=C2=A0 flt=C2=A0 re=C2=A0 pi=C2=A0 po<br>
> > fr=C2=A0 =C2=A0sr ad0 pa0=C2=A0 =C2=A0in=C2=A0 =C2=A0 sy=C2=A0 =
=C2=A0 cs us sy id 1 0 0 31449076<br>
> > 384420 1902=C2=A0 =C2=A09=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 1392=
=C2=A0 861=C2=A0 =C2=A00=C2=A0 =C2=A00=C2=A0 222 15579=C2=A0 5778<br>
> > 14 5 82<br>
> ><br>
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br>
> > EOyNAJ4pUcQHIpLxnd+pLuGS8fKL02HRbACgmfoIR22ub7kGannIpdUvjGVs2pI=
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> > =3DsFDL<br>
> > -----END PGP SIGNATURE-----<br>
> ><br>
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</blockquote></div>
</blockquote></div>
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