X-Authentication-Warning: delorie.com: mail set sender to geda-help-bounces using -f X-Recipient: geda-help AT delorie DOT com To: geda-help AT delorie DOT com From: "Cam (camfarnell AT bitflipper DOT ca) [via geda-help AT delorie DOT com]" Subject: [geda-help] Four layer board Message-ID: Date: Thu, 2 Apr 2020 18:26:43 -0300 User-Agent: Mozilla/5.0 (X11; Linux x86_64; rv:68.0) Gecko/20100101 Thunderbird/68.4.1 MIME-Version: 1.0 Content-Type: text/plain; charset=utf-8; format=flowed Content-Language: en-US Content-Transfer-Encoding: 7bit X-OutGoing-Spam-Status: No, score=-1.0 X-AntiAbuse: This header was added to track abuse, please include it with any abuse report X-AntiAbuse: Primary Hostname - troi.cpanelboxes.net X-AntiAbuse: Original Domain - delorie.com X-AntiAbuse: Originator/Caller UID/GID - [47 12] / [47 12] X-AntiAbuse: Sender Address Domain - bitflipper.ca X-Get-Message-Sender-Via: troi.cpanelboxes.net: authenticated_id: camfarnell AT bitflipper DOT ca X-Authenticated-Sender: troi.cpanelboxes.net: camfarnell AT bitflipper DOT ca X-Source: X-Source-Args: X-Source-Dir: X-From-Rewrite: unmodified, already matched Reply-To: geda-help AT delorie DOT com I'm using PCB 4.0.2. The board is too complex and tight to route with two layers. My next thought is to use four layers with the inner layers being devoted to power and ground with almost the entire layer copper and using thermals where it connects to pins and a gap for non-power pins. But I could see no way to achieve this with PCB. Am I missing something or is that just not supported? I could simply do thick routes for power and ground on the interior layers but then there is the question of how to get power and ground to SMT components which exist only on the component layer. Hand placed vias near where power/ground pins are on the SMT devices? Any advice appreciated. Cam Farnell