X-Authentication-Warning: delorie.com: mail set sender to geda-user-bounces using -f X-Recipient: geda-user AT delorie DOT com DKIM-Signature: v=1; a=rsa-sha256; c=relaxed/relaxed; d=gmail.com; s=20120113; h=message-id:date:from:user-agent:mime-version:to:subject:references :in-reply-to:content-type:content-transfer-encoding; bh=BGh8uyjZ2jjRds83f2ivXqWH6rECZFTGfRYfSM+QgHY=; b=zg3w+VhIyqBAw3DPOFlgingHIcOjlNkk8LQW0jjXQ+T121PJ/IX+5NRSXULnArCQVG qEc7nJSvolqCWUBPNvm00Z4Anec4ob2sNrsbOOTb7Vqnqb5MAy91lBYdFvyT96kZcIqG UXwEEaQc6DZHzzXrMpywpjQPSQF1GebfuMaxumEFNQN5r+PZCy4t0wvLLiUXGtw5mQzS KRgNVKaA180PJQR1AqVu3WR5PKAJ6HbOxnjHg9R8paT59ZxYd2H+6IMNcnESDgO1Ro1P kMxuBtU4sQgXCN2PEgnCq2aCrzbynk8wY/afwJi3k63IaxcuZ5mUSHwx96gN+if5Y85b gr3w== X-Received: by 10.14.246.11 with SMTP id p11mr167547eer.9.1381216885179; Tue, 08 Oct 2013 00:21:25 -0700 (PDT) Message-ID: <5253B271.5020302@gmail.com> Date: Tue, 08 Oct 2013 09:21:21 +0200 From: onetmt User-Agent: Mozilla/5.0 (X11; Linux i686; rv:10.0.12) Gecko/20130116 Icedove/10.0.12 MIME-Version: 1.0 To: geda-user AT delorie DOT com Subject: Re: [geda-user] polygons, arcs and footprints References: <524FB65F DOT 9050604 AT gmail DOT com> <5253AEAD DOT 6050900 AT gmail DOT com> In-Reply-To: <5253AEAD.6050900@gmail.com> Content-Type: text/plain; charset=ISO-8859-1 Content-Transfer-Encoding: 7bit Reply-To: geda-user AT delorie DOT com Il 08/10/2013 09:05, onetmt ha scritto: > Il 06/10/2013 03:43, Evan Foss ha scritto: >> The microphone is an ADMP441. They use a ring round the input port to >> seal between the audio input of the microphone and the PCB. > > You cold give this example a try; maybe, you could also refine the > design in order to avoid the sharp edges (I will send you also the basic > trigonometry I used, in case you would). > ...and, sorry: clearance should have been 0.4mm, not 0.4 >> >> On Sat, Oct 5, 2013 at 2:49 AM, onetmt wrote: >>> Il 04/10/2013 23:56, Evan Foss ha scritto: >>>> Hi folks, >>>> >>>> I am trying to make a footprint for an LTC3441. The bottom pad is a >>>> polygon. I know they are not possible in PCB footprints but does >>>> anyone have a good way to emulation one? >>> >>> For other components - for instance the BSC159 mosfet by Infineon - I >>> used several square pads partially overlapped, in order to get the right >>> "polygonal" pad. But in your case, imho, you should use a "normal" >>> footprint and then design the polygons on layer, placing vias also on >>> central powerpad as indicated in datasheet. >>> >>>> >>>> Also I am trying to use a MEMS microphone that uses a ring to seal it >>>> to the PCB. Again I know that does not exist but is there a way around >>>> it? >>> >>> It's difficult to say without knowing the component, but you can obtain >>> a ring - well, a sort of - by using appropriate clearance around an >>> "octagon" pad and placing a rectangle, maybe on a ground layer, around it. >>> >>>> >>>> -Evan >>>> >>> >>> >>> -- >>> Hofstadter's Law: >>> "It always takes longer than you expect, even when you take into account >>> Hofstadter's Law." >> >> >> > > -- Hofstadter's Law: "It always takes longer than you expect, even when you take into account Hofstadter's Law."